In Labs 5 and 6, the team created four chip lids for future chip designs. In Lab 5, desiccator was used to remove air bubbles in the resin mix. In Lab 6, the hardened mix was cut and punched for future uses.
In Labs 5 and 6, the team created four chip lids for future chip designs. In Lab 5, desiccator was used to remove air bubbles in the resin mix. In Lab 6, the hardened mix was cut and punched for future uses.