My research expertise lies in the area of microparticle adhesion and microparticle manipulation using acoustic techniques coupled with laser interferometry. I also possess research experience in the field of acoustics, surface energy characterization of materials (particles, surface coatings), mechanical vibrations, ultrasonic nondestructive testing, Microelectromechanical systems (MEMS), nondestructive testing of pharmaceutical tablets and additive manufacturing. I am an experimentalist with an adequate knowledge of mathematical modeling. My interest always lied in Academia, my Ph.D. research propelled my interest even further. My research efforts so far have resulted in twelve peer-reviewed publications (five as a first author and rest were as a supporting author) as reflected in my CV.
Current Research:
My current research project as a postdoctoral researcher focuses on characterizing the mechanical properties of biological cells using MEMS devices. We aim to develop this technology to be able characterize cancer cells and understand the cancer prognosis.
Past Research:
My Ph.D. research started with a well-known existing problem in the toner/microparticle adhesion – contribution of electrostatic charge to the adhesion of microparticles. My first project was to evaluate and assess the effect of electrostatic charge on toner adhesion (collaborated with Xerox Corp.). For the first time, we were able to predict the equivalent bulk charge on a single toner particle in a non-contact/non-destructive manner. Following which, I investigated the effect of surface temperature, relative humidity on microparticle adhesion. I also designed and developed an experimental technique to evaluate the adhesion energy distribution on the surface of a microparticle using Surface Acoustic Wave (SAW) based microparticle rolling technique
My other primary research interest lies in the area of characterizing the structural integrity of additive manufactured parts using acoustic techniques. During my Ph.D. I was a co-researcher on a project which focused on characterizing 3D printed phononic artifacts using ultrasonic acoustics. My interest also lies in novel materials characterization, surface energy characterization of thin films and substrates using acoustics techniques. I have experience in characterizing the surface energy of thin films/layers on electronic packaging chips for Intel Corporation using acousto-interferometry techniques and also characterizing the adhesive properties of functionalized substrates (such as silicon substrates functionalized with biotin).